SOI devices for sub-0.1 μm gate lengths

被引:0
|
作者
Colinge, JP [1 ]
Park, JT [1 ]
Colinge, CA [1 ]
机构
[1] Univ Calif Davis, Dept Elect & Comp Engn, Davis, CA 95616 USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Different SOI MOSFET structures for sub 0.1 mum gate lengths are discussed. To reduce short-channel effects such as DIBL and subthreshold slope degradation, thin SOI films have to be used, which causes high source and drain resistance and low threshold voltage problems. These problems can be solved using midgap gate materials, elevated or Schottky S&D structures and multiple gates. The use of ground-plane structures improves the short-channel effects but increase the body effect, while the use of multiple gates (double gate, triple gate, etc.) improves all device characteristics and increase the current drive.
引用
收藏
页码:109 / 113
页数:5
相关论文
共 50 条
  • [1] A notched metal gate MOSFET for sub-0.1 μm operation
    Pidin, S
    Mushiga, M
    Shido, H
    Yamamoto, T
    Sambonsugi, Y
    Tamura, Y
    Sugii, T
    INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 659 - 662
  • [2] Approaches and options for Modeling sub-0.1 μm CMOS devices
    Chan, MS
    Xi, XM
    Jin, H
    Hu, CM
    2002 IEEE HONG KONG ELECTRON DEVICES MEETING, PROCEEDINGS, 2002, : 79 - 82
  • [3] Short channel effects in sub-0.1 mu m SOI-MOSFETs
    Rauly, E
    Balestra, F
    PROCEEDINGS OF THE EIGHTH INTERNATIONAL SYMPOSIUM ON SILICON-ON-INSULATOR TECHNOLOGY AND DEVICES, 1997, 97 (23): : 227 - 232
  • [4] Special issue on advanced sub-0.1 μm CMOS devices -: Foreword
    Hiramoto, T
    IEICE TRANSACTIONS ON ELECTRONICS, 2002, E85C (05) : 1051 - 1051
  • [5] Hot carrier reliability in sub-0.1 mu m nMOSFET devices
    Saha, SK
    MATERIALS RELIABILITY IN MICROELECTRONICS VI, 1996, 428 : 379 - 384
  • [6] Short channel effects in sub-0.1μm thin film SOI-MOSFETs
    Rauly, E
    Balestra, F
    ELECTRONICS LETTERS, 1998, 34 (07) : 700 - 701
  • [7] Monte carlo simulation of sub-0.1μm devices with Schottky contact model
    Matsuzawa, K
    Uchida, K
    Nishiyama, A
    IEICE TRANSACTIONS ON ELECTRONICS, 2000, E83C (08) : 1212 - 1217
  • [8] Lithography trends for sub-0.1μm technologies
    Guibert, JC
    2001 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOL 1 & 2, PROCEEDINGS, 2001, : 439 - 440
  • [9] Silicidation strategy of sub-0.1 mu m junctions for deep submicron devices
    Tsai, JY
    Osburn, CM
    Hsia, SL
    SILICIDE THIN FILMS - FABRICATION, PROPERTIES, AND APPLICATIONS, 1996, 402 : 245 - 250
  • [10] Reliable threshold voltage determination for sub-0.1μm gate length MOSFET's
    Tsuno, M
    Suga, M
    Tanaka, M
    Shibahara, K
    Miura-Mattausch, M
    Hirose, M
    PROCEEDINGS OF THE ASP-DAC '98 - ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 1998 WITH EDA TECHNO FAIR '98, 1998, : 111 - 116