Packaging and process optimization for Three-dimensional structure unit of Double-sided cooling IGBT module

被引：0

作者：

Wang, Chunlei ^{[1
,2
,3
]}

Zheng, Libing ^{[1
,2
]}

Han, Li ^{[1
,2
]}

Fang, Huachao ^{[1
,2
,3
]}

Xu, Ju ^{[1
,2
]}

机构：

[1] Chinese Acad Sci, Beijing Engn Lab Elect Drive Syst & Power Elect D, Beijing, Peoples R China

[2] Chinese Acad Sci, Inst Elect Engn, Beijing, Peoples R China

[3] Univ Chinese Acad Sci, Beijing, Peoples R China

来源：

2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年

关键词：

Packaging; Process optimization; Double-sided cooling; IGBT module; FEM;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively, improve the reliability in some special circumstance. In view of the special requirements of packaging process for double-sided cooling IGBT module, a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built, and the soldering process has been simulated by finite element software. Meanwhile, reflow curve of soldering the Three-dimensional structure of double-sided cooling IGBT module has been determined, and the soldering process has been optimized. Results show that the void rate in each layer of the structure is less than 3%. The optimized parameters of the progress meet the requirement of packaging the Three-dimensional structure of double-sided cooling IGBT module.

引用

页码：626 / 629

页数：4

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