Packaging and process optimization for Three-dimensional structure unit of Double-sided cooling IGBT module

被引：0
|
作者：
Wang, Chunlei [1 ,2 ,3 ]
Zheng, Libing [1 ,2 ]
Han, Li [1 ,2 ]
Fang, Huachao [1 ,2 ,3 ]
Xu, Ju [1 ,2 ]
机构：
[1] Chinese Acad Sci, Beijing Engn Lab Elect Drive Syst & Power Elect D, Beijing, Peoples R China
[2] Chinese Acad Sci, Inst Elect Engn, Beijing, Peoples R China
[3] Univ Chinese Acad Sci, Beijing, Peoples R China
来源：
2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年
关键词：
Packaging; Process optimization; Double-sided cooling; IGBT module; FEM;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Double-sided cooling IGBT module is a kind of package structure which can increase the power density effectively, improve the reliability in some special circumstance. In view of the special requirements of packaging process for double-sided cooling IGBT module, a mathematical model of the soldering process about the Three-dimensional structure of double-sided cooling IGBT module has been built, and the soldering process has been simulated by finite element software. Meanwhile, reflow curve of soldering the Three-dimensional structure of double-sided cooling IGBT module has been determined, and the soldering process has been optimized. Results show that the void rate in each layer of the structure is less than 3%. The optimized parameters of the progress meet the requirement of packaging the Three-dimensional structure of double-sided cooling IGBT module.
引用
收藏
页码：626 / 629
页数：4
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