Characteristics of molybdenum nitride thin film by N2+ ion implantation

被引:0
|
作者
Kim, DJ [1 ]
Kim, IS [1 ]
Kim, YT [1 ]
Park, JW [1 ]
机构
[1] Korea Inst Sci & Technol, Semicond Mat Lab, Seoul 130650, South Korea
来源
MATERIALS RELIABILITY IN MICROELECTRONICS IX | 1999年 / 563卷
关键词
D O I
10.1557/PROC-563-45
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Molybdenum nitride thin films were prepared by N-2(+) implantation with acceleration energy of 20 KeV and the ion dose of 3x10(17) ions/cm(2). The structural property and thermal stability of the films were investigated by XRD, AES, AFM and RES. The crystal structure of N-2(+) implanted molybdenum thin films (Mo-N-2(+)) which had microcrystalline state was transformed to gamma-Mo2N phase with a preferred (111) orientation after a post-annealing at 500 degrees C for 30min. However, a silicide reaction was not observed even after the annealing at 700 degrees C, which is due to the modification of the interface between Mo thin film and Si substrate by N-2(+) implantation. Also, Cu diffusion did not seem to be induced by the annealing at 700 degrees C for 30 min. The internal stress of the Mo-N-2(+) thin films during post-annealing at 600 degrees C for 30min was found to change from highly compressive stress to low tensile stress.
引用
收藏
页码:45 / 50
页数:6
相关论文
共 50 条
  • [41] Effects of N2+ ion implantation on phase transition in Ge2Sb2Te5 films
    Kim, YoungKuk
    Baeck, J. H.
    Cho, M. -H.
    Jeong, E. J.
    Ko, D. -H.
    JOURNAL OF APPLIED PHYSICS, 2006, 100 (08)
  • [42] CONTROL OF POLYCRYSTALLINE-SILICON RESISTOR BY IMPLANTATION OF N2+
    HAYASHI, H
    YAMOTO, H
    OHSHIMA, T
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (03) : C101 - C101
  • [43] Nucleation and growth of AlN nanocrystallites prepared by N2+ implantation
    Reier, T
    Schultze, JW
    Osterle, W
    Buchal, C
    SURFACE & COATINGS TECHNOLOGY, 1998, 104 : 415 - 420
  • [44] Effect of N2+ Ion Implantation and Thermal Annealing on Near-Surface Layers of Implanted GaAs
    Kulik, M.
    Surowiec, Z.
    Rzodkiewicz, W.
    Filiks, J.
    Drozdziel, A.
    ACTA PHYSICA POLONICA A, 2015, 128 (05) : 918 - 922
  • [45] CHARACTERIZATION OF ALUMINUM NITRIDE LAYERS FORMED DIRECTLY BY 700-800 KEV N2+(N-15) IMPLANTATION INTO ALUMINUM
    KIDO, Y
    KAKENO, M
    YAMADA, K
    HIOKI, T
    KAWAMOTO, J
    TADA, M
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1982, 15 (10) : 2067 - 2077
  • [46] Chemical states and photoluminescence of Si0.3Ge0.7-nitride film formed by N2+ gas
    Lee, Y. M.
    Jang, S. H.
    Han, M.
    Jung, M. -C.
    APPLIED PHYSICS LETTERS, 2011, 99 (12)
  • [47] Molybdenum Oxide and Molybdenum Nitride Back Contacts for Thin-Film CdTe Solar Cells
    Kindvall, Anna
    Kephart, Jason
    Sampath, Walajabad
    2017 IEEE 44TH PHOTOVOLTAIC SPECIALIST CONFERENCE (PVSC), 2017, : 785 - 790
  • [48] Stabilization of organic thin film transistors by ion implantation
    Fraboni, B.
    Cosseddu, P.
    Wang, Y. Q.
    Schulze, R. K.
    Cavallini, A.
    Nastasi, M.
    Bonfiglio, A.
    PHYSICA B-CONDENSED MATTER, 2012, 407 (15) : 3047 - 3051
  • [49] Ag Thin Film Dewetting Prevention by Ion Implantation
    Chi, Longxing
    Bassim, Nabil
    ADVANCED MATERIALS INTERFACES, 2019, 6 (11):
  • [50] Variation of Cuxs thin film by ion beam implantation
    Qu, Xiaosheng
    Li, Dejie
    Yao, Baolun
    Taiyangneng Xuebao/Acta Energiae Solaris Sinica, 2000, 21 (03): : 285 - 287