Characteristics of molybdenum nitride thin film by N2+ ion implantation

被引:0
|
作者
Kim, DJ [1 ]
Kim, IS [1 ]
Kim, YT [1 ]
Park, JW [1 ]
机构
[1] Korea Inst Sci & Technol, Semicond Mat Lab, Seoul 130650, South Korea
来源
MATERIALS RELIABILITY IN MICROELECTRONICS IX | 1999年 / 563卷
关键词
D O I
10.1557/PROC-563-45
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Molybdenum nitride thin films were prepared by N-2(+) implantation with acceleration energy of 20 KeV and the ion dose of 3x10(17) ions/cm(2). The structural property and thermal stability of the films were investigated by XRD, AES, AFM and RES. The crystal structure of N-2(+) implanted molybdenum thin films (Mo-N-2(+)) which had microcrystalline state was transformed to gamma-Mo2N phase with a preferred (111) orientation after a post-annealing at 500 degrees C for 30min. However, a silicide reaction was not observed even after the annealing at 700 degrees C, which is due to the modification of the interface between Mo thin film and Si substrate by N-2(+) implantation. Also, Cu diffusion did not seem to be induced by the annealing at 700 degrees C for 30 min. The internal stress of the Mo-N-2(+) thin films during post-annealing at 600 degrees C for 30min was found to change from highly compressive stress to low tensile stress.
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页码:45 / 50
页数:6
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