Thermal transient evaluation and optical characterization of packaged light-emitting diodes

The study signifies the simultaneous thermal and optical characterizations of pre-molded and ceramic package light-emitting diodes (LEDs) at an increasing driving current. Results indicate that at high driving current produces greater luminous intensity and lower LED efficiency. Besides, pre-molded package LED exhibits better thermal management than ceramic package LED at package-level, and in contrast at board-level. Here, the packaging material properties and ratio of contacting surface areas are applied for description.