Thermal transient evaluation and optical characterization of packaged light-emitting diodes

被引：5
|
作者：
Lee, Zhi-Yin [1 ]
Devarajan, Mutharasu [1 ]
机构：
[1] Univ Sains Malaysia, Sch Phys, Nanooptoelect Res & Technol Lab, George Town 11800, Malaysia
来源：
HEAT AND MASS TRANSFER | 2014年 / 50卷 / 06期
关键词：
Light emitting diodes;
D O I：
10.1007/s00231-014-1291-7
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The study signifies the simultaneous thermal and optical characterizations of pre-molded and ceramic package light-emitting diodes (LEDs) at an increasing driving current. Results indicate that at high driving current produces greater luminous intensity and lower LED efficiency. Besides, pre-molded package LED exhibits better thermal management than ceramic package LED at package-level, and in contrast at board-level. Here, the packaging material properties and ratio of contacting surface areas are applied for description.
引用
收藏
页码：787 / 793
页数：7
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