Nanostructured Anodic Multilayer Dielectric Stacked Metal-Insulator-Metal Capacitors

This paper presents the fabrication of Al2O3/TiO2/Al2O3 metal-insulator-metal (MIM) capacitor using anodization technique. High capacitance density of >3.5 fF/mu m(2), low quadratic voltage coefficient of capacitance of <115 ppm/V-2 and a low leakage current density of 4.457 x 10(-11) A/cm(2) at 3 V are achieved which are suitable for analog and mixed signal applications. We found that the anodization voltage played a major role in electrical and structural properties of the thin film. This work suggests that the anodization method can offer crystalline multilayer dielectric stack required for high performance MIM capacitor.