Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

被引：18
|
作者：
Xian, J. W. [1 ]
Belyakov, S. A. [1 ]
Gourlay, C. M. [1 ]
机构：
[1] Univ London Imperial Coll Sci Technol & Med, Dept Mat, London SW7 2AZ, England
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2016年 / 45卷 / 01期
基金：
英国工程与自然科学研究理事会;
关键词：
Pb-free soldering; grain refinement; intermetallics; crystal growth; orientation relationship (OR); heterogeneous nucleation; SN-CU; SOLDER ALLOYS; PHASE; ETA-CU6SN5; ADDITIONS; GROWTH;
D O I：
10.1007/s11664-015-4092-y
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We show that dilute Al additions can control the size of primary Cu6Sn5 rods in Sn-0.7Cu/Cu ball grid array joints. In Sn-0.7Cu-0.05Al/Cu joints, the number of primary Cu6Sn5 per mm(2) is 7 times higher and the mean three-dimensional length of rods is 4 times smaller than in Al-free Sn-0.7Cu/Cu joints, while the area fraction of primary Cu6Sn5 is similar. It is shown that epitaxial nucleation of primary Cu6Sn5 occurs on delta-Cu33Al17 or gamma (1)-Cu9Al4 particles, which are stablea in pound the Sn-0.7Cu-0.05Al melt during holding at 250A degrees C. The observed facet relationships agree well with previously determined orientation relationships between delta-Cu33Al17 and Cu6Sn5 in hypereutectic Sn-Cu-Al alloys and result in a good lattice match with < 2.5% lattice mismatch on two different interfacial planes.
引用
收藏
页码：69 / 78
页数：10
相关论文
共 50 条
  • [1] Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying
    J. W. Xian
    S. A. Belyakov
    C. M. Gourlay
    [J]. Journal of Electronic Materials, 2016, 45 : 69 - 78
  • [2] Heterogeneous Nucleation of Bulk Cu6Sn5 in Sn-Ag-Cu-Al and Sn-Cu-Al Solders
    Xian, J. W.
    Belyakov, S. A.
    Britton, T. B.
    Gourlay, C. M.
    [J]. 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 2241 - 2247
  • [3] Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders
    Xian, J. W.
    Belyakov, S. A.
    Britton, T. B.
    Gourlay, C. M.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 619 : 345 - 355
  • [4] Formation of interfacial η’-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging
    Zhongbing Luo
    Lai Wang
    Qinqin Fu
    Chongqian Cheng
    Jie Zhao
    [J]. Journal of Materials Research, 2011, 26 : 1468 - 1471
  • [5] Formation of interfacial η′-Cu6Sn5 in Sn-0.7Cu/Cu solder joints during isothermal aging
    Luo, Zhongbing
    Wang, Lai
    Fu, Qinqin
    Cheng, Chongqian
    Zhao, Jie
    [J]. JOURNAL OF MATERIALS RESEARCH, 2011, 26 (12) : 1468 - 1471
  • [6] Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints
    G. Q. Wei
    L. C. Du
    Y. P. Jia
    L. Qi
    [J]. Journal of Materials Science: Materials in Electronics, 2015, 26 : 4313 - 4317
  • [7] Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints
    Wei, G. Q.
    Du, L. C.
    Jia, Y. P.
    Qi, L.
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 26 (06) : 4313 - 4317
  • [8] Erratum: Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging
    Zhongbing Luo
    Lai Wang
    Qinqin Fu
    Chongqian Cheng
    Jie Zhao
    [J]. Journal of Materials Research, 2011, 26 : 1742 - 1742
  • [9] Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints
    Shang, Shengyan
    Kunwar, Anil
    Wang, Yanfeng
    Yao, Jinye
    Ma, Haitao
    Wang, Yunpeng
    [J]. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 135 - 140
  • [10] On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration
    Kunwar, Anil
    Ma, Haoran
    Ma, Haitao
    Guo, Bingfeng
    Meng, Zhixian
    Zhao, Ning
    Huang, Mingliang
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (07) : 7699 - 7706
12345