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- [4] Formation of interfacial η’-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging Journal of Materials Research, 2011, 26 : 1468 - 1471
- [6] Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints Journal of Materials Science: Materials in Electronics, 2015, 26 : 4313 - 4317
- [8] Erratum: Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging Journal of Materials Research, 2011, 26 : 1742 - 1742
- [9] Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 135 - 140
- [10] On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration Journal of Materials Science: Materials in Electronics, 2016, 27 : 7699 - 7706