Screwed micro fluidic connections fabricated by ultrasonic hot embossing and welding

被引:0
|
作者
Lee, H-J [1 ,2 ]
Sackmann, J. [1 ]
Park, K. [2 ]
Schomburg, W. K. [1 ]
机构
[1] Rhein Westfal TH Aachen, Konstrukt & Entwicklung Mikrosyst, Campus Blvd 30, D-52074 Aachen, Germany
[2] Seoul Natl Univ Sci Technol, Dept Mech Syst Design Engn, 172 Gongneung, Seoul 01811, South Korea
关键词
INTERCONNECTS;
D O I
10.1007/s00542-018-4236-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recent connection methods to micro fluidic chips, such as gluing tubes and hoses into orifices or pressing a gasket on them have been studied to improve the common problem to establish a connection of the macroscopic world to a fluidic micro system. In this study, micro fluidic chips from polycarbonate plates with screwed connections have been fabricated by ultrasonic hot embossing and welding, both as in plain and out of plain arrangements. To fabricate threads in the polymer plates, an M3 screw was ultrasonically welded into a hole in the chip and the screw was turned out after the process. The tightness of micro channels and fittings was proven by pumping ink and yeast cells through the micro channels and by applying air pressure of up to 700 kPa, respectively. The process introduced here is especially advantageous because sealing micro channels and welding in micro fluidic screwed connections is done in a single fabrication step.
引用
收藏
页码:3825 / 3834
页数:10
相关论文
共 50 条
  • [21] Experimental analysis and numerical simulation of sintered micro-fluidic devices using powder hot embossing process
    Sahli, M. (sahlisofiane2@yahoo.fr), 1600, Springer London (99): : 5 - 8
  • [22] Experimental analysis and numerical simulation of sintered micro-fluidic devices using powder hot embossing process
    M. Sahli
    B. Mamen
    H. Ou
    J.-C. Gelin
    T. Barrière
    M. Assoul
    The International Journal of Advanced Manufacturing Technology, 2018, 99 : 1141 - 1154
  • [23] Fabrication of polymer electronic boards by ultrasonic embossing and welding
    Cui, Liangyu
    Gerhardy, Christof
    Schomburg, Werner K.
    Tian, Yanling
    Zhang, Dawei
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (02): : 365 - 369
  • [24] Ultrasonic welding of artificial leathers with simultaneous embossing of the surface
    Volkov, SS
    Garanin, IN
    Kholopov, YV
    RUSSIAN ULTRASONICS, 1998, 28 (02): : 67 - 75
  • [25] Fabrication of polymer electronic boards by ultrasonic embossing and welding
    Liangyu Cui
    Christof Gerhardy
    Werner K. Schomburg
    Yanling Tian
    Dawei Zhang
    Microsystem Technologies, 2015, 21 : 365 - 369
  • [26] Flexible Polyimide Micropump Fabricated Using Hot Embossing
    Komatsuzaki, Hiroki
    Suzuki, Kenta
    Liu, Yingwei
    Kosugi, Tatsuya
    Ikoma, Ryuta
    Youn, Sung-Won
    Takahashi, Masaharu
    Maeda, Ryutaro
    Nishioka, Yasushiro
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (06)
  • [27] Hot embossing of micro-featured devices
    Chen, SC
    Lin, MC
    Chien, RD
    Liaw, WL
    2005 IEEE INTERNATIONAL CONFERENCE ON MECHATRONICS, 2005, : 777 - 782
  • [28] Micro hot embossing of thermoplastic polymers: a review
    Peng, Linfa
    Deng, Yujun
    Yi, Peiyun
    Lai, Xinmin
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2014, 24 (01)
  • [29] Precise micro pattern replication by hot embossing
    Idei, K
    Mekaru, H
    Takeda, H
    Hattori, T
    JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, 2006, 49 (01) : 69 - 73
  • [30] Optimization of control parameters in micro hot embossing
    He, Yong
    Fu, Jian-Zhong
    Chen, Zi-Chen
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2008, 14 (03): : 325 - 329