Comparison of ultra-thin gate oxide ESD protection capability of silicided and silicide-blocked MOSFETs

被引:1
|
作者
Lee, JH
Shih, JR
Yu, KF
Wu, YH
Ong, TC
机构
来源
2004 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS | 2004年
关键词
D O I
10.1109/RELPHY.2004.1315413
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, ultra-thin oxide ESD protection capability of silicided and silicide-blocked MOSFETs is studied. We find that ground Gate NMOSFETs (GGNMOS) with silicided drain can provide much better ultra-thin oxide ESD protection capability than the GGNMOS with silicide-blocked drain, and oxide damage is occurred at the transient before the device occurring the snapback. Because the device under the TLP and ESD has different discharge behaviors at the transient before the snapback, it results in that TLP test result does not correlate to ESD test result.
引用
收藏
页码:609 / 610
页数:2
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