Characteristics of System in a Package of Synchronous Dynamic Random Access Memory for High-Speed Data Storage Applications

被引：0

作者：

Lai, Yeong-Lin ^{[1
]}

Chiang, Wen-Jung ^{[1
]}

机构：

[1] Natl Changhua Univ Educ, Dept Mechatron Engn, Changhua 50007, Taiwan

来源：

IEEE TRANSACTIONS ON MAGNETICS | 2014年 / 50卷 / 07期

关键词：

Power integrity (PI); signal integrity (SI); synchronous dynamic random access memory (SDRAM); system in a package (SiP);

D O I：

10.1109/TMAG.2014.2306797

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper proposes a system in a package (SiP) integrating a system on a chip (SoC) and a double-data-rate-three synchronous dynamic random access memory (DDR3 SDRAM) for advanced data-storage-based systems. The characteristics of high frequency, signal integrity (SI), and power integrity (PI) were investigated for the SoC/DDR3-SDRAM SiP. The SiP exhibited low insertion loss, wide eye-diagram aperture, and low power impedance. The effect of de-coupling capacitors on the SiP was also examined. The SoC/DDR3-SDRAM SiP achieved excellent performance for high-speed data storage applications.

引用

页数：5

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