FPGA based silicon innovation exploiting "More than Moore" technology

The most recent series of Xilinx FPGAs in 28nm host a wide range of the most advanced technologies. 3D-IC technology has allowed for a doubling of logic capacity in a single device, commensurate with going to the next process node, with the added advantages of reduced power and improved yield. New levels of programmable systems integration are enabled through the co-integration of digital FPGA die with dedicated analog die such as high-speed analog SerDes on a single interposer. Such heterogeneous integration delivers an industry leading 2.8Tb/s of off-chip serial connectivity. This talk reviews what's driving Moore scaling and how it impacts FPGA technology scaling relative to ASSPs and ASICs. It goes on to cover such items as process selection, 3D-IC technology, analog features, as well as power reduction strategies and the migration steps to 20nm and 16nm.