A More than Moore Enabling Wafer Dicing Technology

被引：1
|
作者：
van Borkulo, Jeroen [1 ]
Evertsen, Rogier [1 ]
van der Stam, Richard [1 ]
机构：
[1] ASM Laser Separat Int BV, Beuningen, Netherlands
来源：
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2019年
关键词：
Laser; plasma; dicing; die strength; thin wafer; heterogeneous integration;
D O I：
10.1109/ECTC.2019.00071
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
As the materials that the wafer dicing process need to singulate become more complex, a diverging current Process of Record (PoR) dicing technologies are not able to meet the quality and/or cost requirements. Laser provides the solution to dice all these different materials but has the challenge to achieve the die strength level specified. In this paper, we will elaborate on the advances made to apply a laser full cut process while achieving the required die strength.
引用
收藏
页码：423 / 427
页数：5
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