Low-Loss Wafer-Bonded Silicon Photonic MEMS Switches

被引：0
|
作者：
Honardoost, Amirmahdi [1 ]
Henriksson, Johannes [1 ]
Kwon, Kyungmok [1 ]
Luo, Jianheng [1 ]
Wu, Ming C. [1 ]
机构：
[1] Univ Calif Berkeley, 550 Sutardja Dai Hall, Berkeley, CA 94720 USA
来源：
2022 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC) | 2022年
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We report on 32x32 silicon photonic switches realized through wafer bonding. Broadband operation is demonstrated over 1260-1320 nm range. The maximum on-chip loss is measured to be 4 dB and the cross-talk is -80 dB. (C) 2022 The Author(s)
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页数：3
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