Reliability of tin-lead balled BGAs soldered with lead-free solder paste

被引：13
|
作者：
Nurmi, ST [1 ]
Ristolainen, EO [1 ]
机构：
[1] Tampere Univ Technol, Elect Lab, FIN-33101 Tampere, Finland
来源：
SOLDERING & SURFACE MOUNT TECHNOLOGY | 2002年 / 14卷 / 02期
关键词：
lead-free; temperature cycling; ball grid array;
D O I：
10.1108/09540910210427808
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper will describe tests of the interconnect reliability of BGA components with tin-lead bumps soldered with lead-free solder paste during temperature cycling. Tin-lead BGA components soldered with tin-lead solder paste and lead-free BGA components soldered with lead-free solder paste were used as a reference. The lead-free solder used was eutectic tin-silver-copper, Two kinds of surface finishes were used on the printed circuit boards (PCB), an immersion gold over electroless nickel and an organic solderability preservative. The test PCBs were temperature-cycled for 2500 cycles in the range of - 40degreesC to + 125degreesC and they were continuously electrically monitored during the cycling. The results of the temperature cycling test showed that lead-containing BGA components soldered with lead-free solder paste don't show any serious reliability risks and can actually withstand temperature cycling stresses better than entirely lead-free BGA assemblies.
引用
收藏
页码：35 / 39
页数：5
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