A new bumping process using lead-free solder paste

被引：3
|
作者：
Suga, T [1 ]
Saito, K [1 ]
机构：
[1] Univ Tokyo, Adv Sci & Technol Res Ctr, Tokyo 1538904, Japan
来源：
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2002年 / 25卷 / 04期
关键词：
lead-free solder bumping; hydrogen radicals; flux residues; surface oxides;
D O I：
10.1109/TEPM.2002.807724
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, we report development of a new process for lead-free solder bumping with no flux residues, using stencil printing and hydrogen radicals, which can lessen both the environmental load and the manufacturing cost of solder bumping. In this process the reduction of the hydrogen radicals, instead of the flux, will eliminate the surface oxides of the stencil printed lead-free solder paste. Sn-3.0Ag-0.5Cu lead-free solder paste, which contains no residue flux was printed on an 8-in wafer. Hydrogen plasma was radiated for a minute during the reflow process, and the printed paste formed a bump. Reflow experiments without hydrogen radicals treatment were also carried out for comparison, where no successful reflow could be observed.
引用
收藏
页码：253 / 256
页数：4
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