Development of silicon containing resists for sub-100nm lithography

被引:7
|
作者
Hatakeyama, J [1 ]
Takeda, T [1 ]
Nakashima, M [1 ]
Kinsho, T [1 ]
Kawai, Y [1 ]
Ishihara, T [1 ]
机构
[1] Shin Etsu Chem Co Ltd, New Funct Mat Res Ctr, Niigata 9428601, Japan
关键词
bilayer resist; SSQ; silicon-containing olefin; alternating copolymer;
D O I
10.2494/photopolymer.17.519
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Polysilsesquioxane (SSQ) and alternating-copolymers of silicon containing olefin with maleic anhydride (SiMA) have been employed as backbone polymers of silicon containing bilayer resists. Several kinds of functional alkoxysilanes to form SSQ and silicon containing olefins for SiMA have been synthesized. Fluorinated alcohol as an adhesion unit in SSQ effectively reduces micro swelling in developer. Alternating copolymer structure in SiMA minimizes line edge roughness. Characteristics of oxygen reactive ion etching resistance onto the SSQ and SiMA polymers will be also discussed.
引用
收藏
页码:519 / 525
页数:7
相关论文
共 50 条
  • [21] NiSi salicide for sub-100nm CMOS
    Xiang, Q
    SEMICONDUCTOR SILICON 2002, VOLS 1 AND 2, 2002, 2002 (02): : 354 - 361
  • [22] Advances in CPL, collimated plasma source & full field exposure for sub-100nm lithography
    Boerger, B
    Mcleod, S
    Forber, R
    Turcu, E
    Gaeta, C
    Bailey, DK
    Ben-Jacob, J
    EMERGING LITHOGRAPHIC TECHNOLOGIES VII, PTS 1 AND 2, 2003, 5037 : 1112 - 1122
  • [23] A strategy for enabling predictive TCAD in development of sub-100nm CMOS technologies
    Machala, CF
    Chakravarthi, S
    Li, D
    Yang, SH
    Bowen, C
    SISPAD 2002: INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, 2002, : 33 - 38
  • [24] Development of in-situ SUB-100nm particle detection in vacuum system
    Ahn, Kang-Ho
    Kim, Yong-min
    ADVANCED NONDESTRUCTUVE EVALUATION I, PTS 1 AND 2, PROCEEDINGS, 2006, 321-323 : 1707 - 1710
  • [25] New DFM approach abstracts AItPSM lithography requirements for sub-100nm IC design domains
    Ghosh, P
    Kang, CS
    Sanie, M
    Pinto, D
    4TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, PROCEEDINGS, 2003, : 131 - 137
  • [26] Patterning sub-100nm features for submicron devices
    Kavak, H
    Goodberlet, JG
    NANOENGINEERED NANOFIBROUS MATERIALS, 2004, 169 : 529 - 534
  • [27] Approach for physical design in sub-100nm era
    Masuda, H
    Okawa, S
    Aoki, M
    2005 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), VOLS 1-6, CONFERENCE PROCEEDINGS, 2005, : 5934 - 5937
  • [28] Copper contact technology for sub-100nm contacts
    Demuynck, Steven
    Zhao, Chao
    Van den Bosch, Geert
    Hinomura, Toru
    Tokei, Zsolt
    Beyer, Gerald P.
    ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007), 2008, 23 : 171 - 177
  • [29] Electrical properties of sub-100nm SiGe nanowires
    BHamawandi
    MNoroozi
    GJayakumar
    AErgl
    KZahmatkesh
    MSToprak
    HHRadamson
    Journal of Semiconductors, 2016, 37 (10) : 14 - 19
  • [30] Sub-100nm interconnects using multistep plating
    Yang, MX
    Mao, DX
    Yu, CM
    Dukovic, J
    Xi, M
    SOLID STATE TECHNOLOGY, 2003, 46 (10) : 37 - +