Dynamics of carrier transport via AlGaN barrier in AlGaN/GaN MIS-HEMTs

被引:8
|
作者
Ostermaier, C. [1 ]
Lagger, P. [1 ]
Prechtl, G. [1 ]
Grill, A. [2 ]
Grasser, T. [2 ]
Pogany, D. [2 ]
机构
[1] Infineon Technol Austria AG, A-9500 Villach, Austria
[2] TU Wien, A-1040 Vienna, Austria
关键词
POLARIZATION; NOISE;
D O I
10.1063/1.4982231
中图分类号
O59 [应用物理学];
学科分类号
摘要
Exchange of carriers between the GaN channel and the dielectric/AlGaN interface in AlGaN/GaN metal insulator semiconductor high electron mobility transistors was recently attributed to a serial process of electron transport through the AlGaN barrier and electron trapping/emission at the interface. In this paper, the time constant related to barrier transport is evaluated from the measurements of time onset of threshold voltage drift in stress-recovery experiments. Temperature and forward gate bias dependent studies reveal an activation energy of 0.65 eV for the electron transport at zero bias being consistent with the estimated potential barrier of 0.75 eV at the dielectric/AlGaN interface. Thermo-ionic emission and defect assisted tunneling to near interface states are considered as transport mechanisms. Published by AIP Publishing.
引用
收藏
页数:4
相关论文
共 50 条
  • [1] AlGaN/GaN MIS-HEMTs with a p-GaN Cap Layer
    Che-Ching Hsu
    Pei-Chien Shen
    Yi-Nan Zhong
    Yue-Ming Hsin
    [J]. MRS Advances, 2018, 3 (3) : 143 - 146
  • [2] AlGaN/GaN MIS-HEMTs with a p-GaN Cap Layer
    Hsu, Che-Ching
    Shen, Pei-Chien
    Zhong, Yi-Nan
    Hsin, Yue-Ming
    [J]. MRS ADVANCES, 2018, 3 (03): : 143 - 146
  • [3] Drain current DLTS of AlGaN-GaN MIS-HEMTs
    Okino, T
    Ochiai, A
    Ohno, Y
    Kishimoto, S
    Maezawa, K
    Mizutani, I
    [J]. IEEE ELECTRON DEVICE LETTERS, 2004, 25 (08) : 523 - 525
  • [4] Influence of channel/back-barrier thickness on the breakdown of AlGaN/GaN MIS-HEMTs
    Zhao, Jie
    Xing, Yanhui
    Fu, Kai
    Zhang, Peipei
    Song, Liang
    Chen, Fu
    Yang, Taotao
    Deng, Xuguang
    Zhang, Sen
    Zhang, Baoshun
    [J]. JOURNAL OF SEMICONDUCTORS, 2018, 39 (09)
  • [5] Effect of temperature on cryogenic characteristics of AlGaN/GaN MIS-HEMTs
    Endoh, Akira
    Watanabe, Issei
    Yamashita, Yoshimi
    Mimura, Takashi
    Matsui, Toshiaki
    [J]. PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 6, SUPPL 2, 2009, 6 : S964 - S967
  • [6] Influence of channel/back-barrier thickness on the breakdown of AlGaN/GaN MIS-HEMTs
    Jie Zhao
    Yanhui Xing
    Kai Fu
    Peipei Zhang
    Liang Song
    Fu Chen
    Taotao Yang
    Xuguang Deng
    Sen Zhang
    Baoshun Zhang
    [J]. Journal of Semiconductors, 2018, 39 (09) : 33 - 37
  • [7] The Impact of AlGaN Barrier on Transient VTH Shifts and VTH Hysteresis in Depletion and Enhancement mode AlGaN/GaN MIS-HEMTs
    Lu, Bohan
    Cui, Miao
    Liu, Wen
    [J]. 17TH IEEE INTERNATIONAL CONFERENCE ON IC DESIGN AND TECHNOLOGY (ICICDT 2019), 2019,
  • [8] Performance Enhancement of AlGaN/GaN MIS-HEMTs Realized via Supercritical Nitridation Technology
    Liu, Meihua
    Huang, Zhangwei
    Chang, Kuanchang
    Lin, Xinnan
    Li, Lei
    Jin, Yufeng
    [J]. CHINESE PHYSICS LETTERS, 2020, 37 (09)
  • [9] Detrapping Kinetics in N-polar AlGaN/GaN MIS-HEMTs
    Chiocchetta, Francesca
    Calascione, Claudia
    De Santi, Carlo
    Sharma, Chandan
    Rampazzo, Fabiana
    Zheng, Xun
    Romanczyk, Brian
    Guidry, Matt
    Li, Haoran
    Keller, Stacia
    Mishra, Umesh
    Meneghesso, Gaudenzio
    Meneghini, Matteo
    Zanoni, Enrico
    [J]. 2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2021, : 90 - 94
  • [10] AlGaN/GaN MIS-HEMTs with HfO2 gate insulator
    Kawano, A.
    Vishimoto, S.
    Ohno, Y.
    Maezawa, K.
    Mizutani, Takashi
    Ueno, H.
    Ueda, T.
    Tanaka, T.
    [J]. PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 4 NO 7 2007, 2007, 4 (07): : 2700 - +