Nickel Electrodeposition studies for high-aspect-ratio microstructure fabrication for MEMS

被引：1

作者：

Xin, Tinghui ^{[1
]}

Ajmera, Pratul K. ^{[1
]}

机构：

[1] Louisiana State Univ, Dept Elect & Comp Engn, Integrated Microsyst Grp, Elect Mat & Device Lab, Baton Rouge, LA 70803 USA

来源：

SMART STRUCTURES AND MATERIALS 2006: SMART ELECTRONICS, MEMS, BIOMEMS, AND NANOTECHNOLOGY | 2006年 / 6172卷

基金：

美国国家科学基金会;

关键词：

nickel electroplating for MEMS; high-aspect ratio structures; DC plating; pulse plating; stress in electroplated nickel;

D O I：

10.1117/12.659104

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This work investigates both DC and pulse electroplating techniques for nickel. A nickel sulfamate electrolyte is utilized for nickel deposition over Cu/Ti coated silicon substrates. Stress levels and grain morphology are investigated and analyzed for the electroplated nickel deposit. A comparison is also made between the results obtained from DC and from long and short duration pulse electroplating techniques. Both compressive and tensile built-in stresses are observed in both DC and long duration pulse plated nickel while only compressive stresses are observed in short duration pulse plated nickel.

引用

页数：10

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