Nickel Electrodeposition studies for high-aspect-ratio microstructure fabrication for MEMS

被引：1
|
作者：
Xin, Tinghui [1 ]
Ajmera, Pratul K. [1 ]
机构：
[1] Louisiana State Univ, Dept Elect & Comp Engn, Integrated Microsyst Grp, Elect Mat & Device Lab, Baton Rouge, LA 70803 USA
来源：
SMART STRUCTURES AND MATERIALS 2006: SMART ELECTRONICS, MEMS, BIOMEMS, AND NANOTECHNOLOGY | 2006年 / 6172卷
基金：
美国国家科学基金会;
关键词：
nickel electroplating for MEMS; high-aspect ratio structures; DC plating; pulse plating; stress in electroplated nickel;
D O I：
10.1117/12.659104
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This work investigates both DC and pulse electroplating techniques for nickel. A nickel sulfamate electrolyte is utilized for nickel deposition over Cu/Ti coated silicon substrates. Stress levels and grain morphology are investigated and analyzed for the electroplated nickel deposit. A comparison is also made between the results obtained from DC and from long and short duration pulse electroplating techniques. Both compressive and tensile built-in stresses are observed in both DC and long duration pulse plated nickel while only compressive stresses are observed in short duration pulse plated nickel.
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页数：10
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