Low-Frequency Noise Sources in Advanced UTBB FD-SOI MOSFETs

被引:40
|
作者
Theodorou, Christoforos G. [1 ]
Ioannidis, Eleftherios G. [2 ,3 ]
Andrieu, Francois [4 ]
Poiroux, Thierry [4 ]
Faynot, Olivier [4 ]
Dimitriadis, Charalabos A. [1 ]
Ghibaudo, Gerard [2 ,3 ]
机构
[1] Aristotle Univ Thessaloniki, Dept Phys, Thessaloniki 54124, Greece
[2] INPG, MINATEC, Inst Microelect Electromagnetisme & Photon, F-38016 Grenoble, France
[3] INPG, MINATEC, LA Boratoire Hyperfrequences & Caracterisat, F-38016 Grenoble, France
[4] LETI CEA, F-38054 Grenoble, France
关键词
Generation-recombination (g-r) noise; low-frequency noise (LFN); ultrathin body and buried oxide fully depleted silicon-on-insulator (UTBB FDSOI MOSFETs); GENERATION-RECOMBINATION NOISE; GATE; INTERFACE; BACK;
D O I
10.1109/TED.2014.2307201
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The low-frequency noise (LFN) sources in ultrathin body (8.7 nm) and buried oxide (10 nm) fully depleted silicon-on- insulator (UTBB FD-SOI) n- and p-channel MOSFETs are analyzed. Both flicker and Lorentzian-type noise were observed, showing a dependence on the channel dimensions and the front/back gate bias conditions. The flicker noise component can be described by the carrier number with correlated mobility fluctuations model considering contribution from both interfaces. The Lorentzian-type noise originates mainly from generationrecombination (g-r) traps in the Si film, uniformly distributed in thin layers next to the drain and source contacts, and in some cases from g-r traps located at the front Si/oxide interface. No different noise behavior was observed between n- and p-channel devices operating in front-gate mode. Finally, LFN comparison between FD-SOI devices of different technologies is presented for the first time, demonstrating the impact of the UTBB technology on the LFN properties.
引用
收藏
页码:1161 / 1167
页数:7
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