The effect of curing process on laser releasable de-bonding temporary material for 3D packages

被引：0
|
作者：
Xia Jianwen [1 ]
Zhang Guoping [1 ]
机构：
[1] Shenzhen Samcien Semicond Mat Co Ltd, Dept Res & Dev, Shenzhen, Peoples R China
来源：
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2017年
关键词：
Temporary de-bonding material; Laser de-bonding; 3D packages;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, UV laser systems with 308 nm was focused. we studied a special release material which showed intense absorption more than 90% on 308 nm laser. And the effect of curing process of laser releasable material was studied. In addition, thermal stability was investigated, showing excellent performance such as the T-5% (temperature of 5% weight loss) >587 degrees C. Finally, the laser releasable material coating on the supporting wafer was paired with a adhesive material on the device wafer, and after the thinning process, the de-bonding was operated by laser (308 nm) irradiation. The result showed that the wafers were easily separated and the supporting wafer was easily cleaned which could be recycled.
引用
收藏
页码：1533 / 1536
页数：4
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