The effect of curing process on laser releasable de-bonding temporary material for 3D packages

被引：0

作者：

Xia Jianwen ^{[1
]}

Zhang Guoping ^{[1
]}

机构：

[1] Shenzhen Samcien Semicond Mat Co Ltd, Dept Res & Dev, Shenzhen, Peoples R China

来源：

2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2017年

关键词：

Temporary de-bonding material; Laser de-bonding; 3D packages;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, UV laser systems with 308 nm was focused. we studied a special release material which showed intense absorption more than 90% on 308 nm laser. And the effect of curing process of laser releasable material was studied. In addition, thermal stability was investigated, showing excellent performance such as the T-5% (temperature of 5% weight loss) >587 degrees C. Finally, the laser releasable material coating on the supporting wafer was paired with a adhesive material on the device wafer, and after the thinning process, the de-bonding was operated by laser (308 nm) irradiation. The result showed that the wafers were easily separated and the supporting wafer was easily cleaned which could be recycled.

引用

页码：1533 / 1536

页数：4

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