New version of Automated Electro-Thermal Analysis in Mentor Graphics PCB Design System

被引：0
|
作者：
Petrosyants, K. O. [1 ]
Kozynko, P. A.
Kharitonov, I. A. [1 ]
Sidorov, A. V.
Chichkanov, Y. N. [1 ]
机构：
[1] Moscow State Inst Elect & Math, Dept Elect & Elect Engn, Moscow, Russia
来源：
PROCEEDINGS OF IEEE EAST-WEST DESIGN & TEST SYMPOSIUM (EWDTS 2013) | 2013年
基金：
俄罗斯基础研究基金会;
关键词：
PCB; Mentor Graphics; Electro-thermal simulation; automation;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Automated electro-thermal analysis is realized in the last version of Mentor Graphics PCB Design System. The special software tool AETA is developed and integrated into the Expedition Enterprise PCB Design System to automate the process of power-temperature traffic between electrical and thermal simulators. Furthermore AETA provides the graphical user interface and the possibility to use the different versions of Mentor Graphics software.
引用
收藏
页数：4
相关论文
共 50 条
  • [41] Design and optimization based on uncertainty analysis in electro-thermal excited MEMS resonant sensor
    Shi, Huichao
    Fan, Shangchun
    Zhang, Yuwen
    Sun, Jinhao
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2015, 21 (04): : 757 - 771
  • [42] Design and optimization based on uncertainty analysis in electro-thermal excited MEMS resonant sensor
    Huichao Shi
    Shangchun Fan
    Yuwen Zhang
    Jinhao Sun
    Microsystem Technologies, 2015, 21 : 757 - 771
  • [43] Electro-Thermal Coupling Finite Element Analysis and Optimization Design of Current Lead in SMES
    Ma, Jing
    Liu, Ruifang
    Zhang, Hongjie
    IEEE PEDG 2010: THE 2ND INTERNATIONAL SYMPOSIUM ON POWER ELECTRONICS FOR DISTRIBUTED GENERATION SYSTEMS, 2010, : 778 - 781
  • [44] Electro-thermal coupling analysis methodology for RF circuits
    Gomez, Didac
    Dufis, Cedric
    Altet, Josep
    Mateo, Diego
    Luis Gonzalez, Jose
    MICROELECTRONICS JOURNAL, 2012, 43 (09) : 633 - 641
  • [45] Electro-thermal coupled analysis of MOSFET under IEMI
    Li, Yong
    Xie, Haiyan
    Wang, Jianguo
    2018 INTERNATIONAL APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY SYMPOSIUM IN CHINA (ACES-CHINA 2018), 2018,
  • [46] Simulation Analysis of the Electro-Thermal Performance of SOI FinFETs
    Wang, L.
    Sadi, T.
    Brown, A. R.
    Nedjalkov, M.
    Alexander, C.
    Cheng, B.
    Millar, C.
    Asenov, A.
    2016 JOINT INTERNATIONAL EUROSOI WORKSHOP AND INTERNATIONAL CONFERENCE ON ULTIMATE INTEGRATION ON SILICON (EUROSOI-ULIS 2016), 2016, : 56 - 59
  • [47] Effect of the device structure in electro-thermal analysis of SiCMOS
    Hatakeyama, Tomoyuki
    Fushinobu, Kazuyoshi
    Okazaki, Ken
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 2069 - 2074
  • [48] Design and experimental testing of an electro-thermal microgripper for cell manipulation
    Soma, Aurelio
    Iamoni, Sonia
    Voicu, Rodica
    Muller, Raluca
    Al-Zandi, Muaiyd H. M.
    Wang, Changhai
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (02): : 1053 - 1060
  • [49] Design and simulation of electro-thermal compliant MEMS logic gates
    Pandiyan, P.
    Uma, G.
    Umapathy, M.
    COMPEL-THE INTERNATIONAL JOURNAL FOR COMPUTATION AND MATHEMATICS IN ELECTRICAL AND ELECTRONIC ENGINEERING, 2018, 37 (02) : 868 - 889
  • [50] Electro-Thermal Analysis for Automotive High Power MOSFETs
    Kempitiya, Asantha
    Chou, Wibawa
    2017 THIRTY-THIRD ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2017, : 302 - 305
12345