Thermal Performance of CoolCube™ Monolithic and TSV-based 3D Integration Processes

被引：0
|
作者：
Santos, C. [1 ,2 ]
Vivet, P. [1 ,2 ]
Thuries, S. [1 ,2 ]
Billoint, O. [1 ,2 ]
Colonna, J. -P. [1 ,2 ]
Coudrain, P. [3 ]
Wang, L. [4 ]
机构：
[1] Univ Grenoble Alpes, F-38000 Grenoble, France
[2] CEA, LETI, MINATEC Campus, F-38054 Grenoble, France
[3] STMicroelectronics, 850 Rue Jean Monnet, F-38926 Crolles, France
[4] Calibre Design Solut, Mentor Graph, Fremont, CA 94538 USA
来源：
2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC) | 2016年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
CoolCube (TM) is a monolithic 3D technology which has the potential to solve the interconnection density limitation of the existing TSV-based 3D integration processes. Since the active devices are fabricated on extremely thin die substrates, heat dissipation has been pointed as a potential showstopper issue for this emerging technology. This work provides a comparative study of the thermal performance of the CoolCube and TSV-based 3D integration processes for a range of technology parameters and application scenarios. Results show that CoolCube exhibits thermal performance similar to or even better than the TSV-based technologies thanks to its very tight die-to-die thermal coupling.
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页数：4
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