Advanced Process Control (APC) and Real Time Dispatch (RTD) system integration for Etch Depth Control process in 300mm Fab

被引：0
|
作者：
Agrawal, Gaurav K. [1 ]
Loh, Soon Yoong [1 ]
Shebi, Abemelek B. [2 ]
机构：
[1] GlobalFoundries, Malta, NY 12020 USA
[2] Final Phase Syst, Austin, TX 78741 USA
来源：
2015 26TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC) | 2015年
关键词：
APC; Etch; Run-to-Run; RTD; System Integration; 300mm Semiconductor Manufacturing; TO-RUN CONTROL; FEEDBACK-CONTROL; VIRTUAL METROLOGY; SEMICONDUCTOR;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Most commonly used feed forward and feedback threaded control algorithms are not always sufficed to achieve the expected process control results. New smaller node sizes and complex process control requirements demand for new and embedded solutions. This paper discusses an advanced integration approach where a complete automation solution was designed and implemented by integrating Real Time Dispatching (RTD) and Advanced Process Control (APC) systems, delivering to complex custom process control requirements for a critical Deep Trench (DT) Poly Stud Recess Etch.
引用
收藏
页码：390 / 394
页数：5
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