Physical Thickness 1.x nm Ferroelectric HfZrOx Negative Capacitance FETs

被引:0
|
作者
Lee, M. H. [1 ]
Fan, S. -T. [2 ]
Tang, C. -H. [1 ]
Chen, P. -G. [1 ,3 ]
Chou, Y. -C. [1 ]
Chen, H. -H. [1 ]
Kuo, J. -Y. [1 ]
Xie, M. -J. [1 ]
Liu, S. -N. [1 ]
Liao, M. -H. [3 ]
Jong, C. -A. [4 ]
Li, K. -S. [4 ]
Chen, M. -C. [4 ]
Liu, C. W. [2 ]
机构
[1] Natl Taiwan Normal Univ, Inst Electroopt Sci & Technol, Taipei, Taiwan
[2] Natl Taiwan Univ, Grad Inst Elect Engn, Taipei, Taiwan
[3] Natl Taiwan Univ, Dept Mech Engn, Taipei, Taiwan
[4] Natl Nano Device Labs, Hsinchu, Taiwan
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ferroelectric HfZrOx (FE-HZO) negative capacitance (NC) FETs is experimentally demonstrated with physical thickness 1.5 nm, SS = 52 mV/dec, hysteresis free (threshold voltage shift = 0.8 mV), and 0.65 nm CET (capacitance equivalent thickness). The NC-FinFET modeling is validated on standard 14nm FinFET. The transient behavior of gate and drain current response are exhibited with triangular gate voltage sweep. The dynamic NC model with compact equivalent circuit for ultra-thin FE-HZO is established with experimental data validation, and estimates the fast response. A feasible concept of coupling the ultra-thin FE-HZO (1.x nm) with NC as gate stack paves a promising solution for sub-10nm technology node.
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页数:4
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