Micro-LEGO for MEMS

被引:15
|
作者
Kim, Seok [1 ]
机构
[1] Univ Illinois, Dept Mech Sci & Engn, 1206 West Green St, Urbana, IL 61801 USA
基金
美国国家科学基金会;
关键词
microassembly; MEMS; transfer printing; elastomer stamp; shape memory polymer; VERTICAL COMB-DRIVE; TILT-PISTON MICROMIRROR; SHAPE-MEMORY POLYMERS; ELASTOPLASTIC ANALYSIS; ELASTOMERIC SURFACES; SYSTEMS MEMS; SOI WAFER; ADHESION; SILICON; RF;
D O I
10.3390/mi10040267
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication. Micro-LEGO involves transfer printing and thermal processing of prefabricated micro/nanoscale materials to assemble structures and devices in a 3D manner without requiring any wet or vacuum processes. Therefore, it complements existing microfabrication and other micro-assembly methods. In this paper, the process components of micro-LEGO, including transfer printing with polymer stamps, material preparation and joining, are summarized. Moreover, recent progress of micro-LEGO within MEMS applications are reviewed by investigating several example devices which are partially or fully assembled via micro-LEGO.
引用
收藏
页数:24
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