Analysis of the Influence of Substrate on the Performance of On-Chip MOS Decoupling Capacitors

被引:3
|
作者
Rius, Josep [1 ]
Meijer, Maurice [2 ]
机构
[1] Univ Politecn Cataluna, Dept Elect Engn, E-08028 Barcelona, Spain
[2] NXP Semicond Res, Mixed Signal Circuit & Syst Grp, Eindhoven, Netherlands
关键词
Distributed parameter circuit; on-chip decoupling capacitor; wafer substrate;
D O I
10.1109/JSSC.2008.2010806
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The interaction between substrate and devices is normally neglected during the design of on-chip MOS decoupling capacitors (decaps). However, it may significantly influence the decap performance to reduce high-frequency power supply noise. In this paper we propose a novel six-parameter analytical decap model which accounts for substrate and device interactions. Our model has been compared against state-of-the-art decap models. Moreover, it has been extensively validated through simulations and measurements. For 65 nm LP-CMOS, a close correlation has been obtained over a large frequency range from 10 MHz up to 10 GHz. Furthermore, we introduce the maximum decap admittance as a new metric for decap performance qualification. Closed-form expressions have been derived to calculate maximum admittance. Finally, we determine the relationship between relevant figure-of-merit parameters for decap design optimization.
引用
收藏
页码:484 / 494
页数:11
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