Permanent Wafer Bonding and Temporary Wafer Bonding/De-Bonding Technology Using Temperature Resistant Polymers

被引：11

作者：

Ishida, Hiroyuki ^{[1
]}

Lutter, Stefan ^{[2
]}

机构：

[1] SUSS MicroTec KK, Bonder Div, Midori Ku, Yokohama, Kanagawa 2260006, Japan

[2] A SUSS MicroTec AG Co, SUSS MicroTec Lithog GmbH, Bonder Div, D-75447 Sternenfels, Germany

来源：

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2014年 / 27卷 / 02期

关键词：

wafer bonding; temporary bonding; de-bonding; silicone; polyimide; MEMS; 3D stacking;

D O I：

10.2494/photopolymer.27.173

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

There can be two kinds of de-bonding options in the aspect of the releasing interface, one is carrier release and the other is device wafer release. Thermoplastic adhesives are used in most cases for carrier release because the materials can easily be cleaned by solvent. On the other hand, device wafer release is usually selected for thermoset adhesives, which is difficult to remove by solvent. © 2014SPST.

引用

页码：173 / 176

页数：4

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