Quasi-damascene metal gate/high-k CMOS using oxygenation through gate electrodes

被引:7
|
作者
Choi, Changhwan [1 ]
Ando, Takashi [1 ]
Cartier, Eduard [1 ]
Frank, Martin M. [1 ]
Iijima, Ryosuke [2 ]
Narayanan, Vijay [1 ]
机构
[1] IBM Corp, Div Res, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
[2] Albany Nanotech, Toshiba Amer Elect Components, Albany, NY 12203 USA
关键词
High-k gate dielectric; Replacement gate process; Oxygenation;
D O I
10.1016/j.mee.2009.03.057
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a novel metal gate/high-k complementary metal-oxide-semi conductor (CMOS) integration scheme with symmetric and low threshold voltage (V-th) for both n-channel (nMOSFET) and p-channel (pMOSFET) metal-oxide-semi conductor field-effect transistors. The workfunction of pMOSFET is modulated by oxygen in-diffusion ('oxygenation') through the titanium nitride metal gate without equivalent oxide thickness (EOT) degradation. A significant Vth improvement by 420 mV and an aggressively scaled capacitance equivalent thickness under channel inversion (T-inv) of 1.3 nm is achieved for the pFET by using a replacement process in conjunction with optimized oxygenation process. Immunity of nMOSFET against oxygenation process is demonstrated. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:1737 / 1739
页数:3
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