Thermal Modeling and Simulation of High Power LED Module

被引：3
|
作者：
Baran, Krzysztof [1 ]
Lesko, Marcin [1 ]
Wachta, Henryk [1 ]
Rozowicz, Antoni [2 ]
机构：
[1] Rzeszow Univ Technol, Powstancow Warszawy St 12, PL-35959 Rzeszow, Poland
[2] Kielce Univ Technol, Tysiaclecia Panstwa Polskiego St 7, PL-25314 Kielce, Poland
来源：
COMPUTATIONAL TECHNOLOGIES IN ENGINEERING (TKI'2018) | 2019年 / 2078卷
关键词：
D O I：
10.1063/1.5092051
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
The article presents the selected issues related to precise thermal modeling of the LED module using CFD software. Determining the temperature of the junction of semiconductor light sources at the stage of designing the module or luminaire is essential in the context of determining its impact on reliability, or changing the light parameters during the operation of the luminaire under real conditions. The obtained simulation research results were modified on the real object.
引用
收藏
页数：8
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