Thermal Modeling and Simulation of High Power LED Module

被引：3
|
作者：
Baran, Krzysztof [1 ]
Lesko, Marcin [1 ]
Wachta, Henryk [1 ]
Rozowicz, Antoni [2 ]
机构：
[1] Rzeszow Univ Technol, Powstancow Warszawy St 12, PL-35959 Rzeszow, Poland
[2] Kielce Univ Technol, Tysiaclecia Panstwa Polskiego St 7, PL-25314 Kielce, Poland
来源：
COMPUTATIONAL TECHNOLOGIES IN ENGINEERING (TKI'2018) | 2019年 / 2078卷
关键词：
D O I：
10.1063/1.5092051
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
The article presents the selected issues related to precise thermal modeling of the LED module using CFD software. Determining the temperature of the junction of semiconductor light sources at the stage of designing the module or luminaire is essential in the context of determining its impact on reliability, or changing the light parameters during the operation of the luminaire under real conditions. The obtained simulation research results were modified on the real object.
引用
收藏
页数：8
相关论文
共 50 条
  • [41] Thermal Stress Simulation Analysis of LGA Power Module Package
    Liu, JianHui
    Wang, WeiYin
    Zhao, XiaoWei
    2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2020,
  • [42] 3-D Thermal Simulation of Power Module Packaging
    Swan, I. R.
    Bryant, A. T.
    Parker-Allotey, N. -A.
    Mawby, P. A.
    2009 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION, VOLS 1-6, 2009, : 1185 - 1192
  • [43] Fatigue Failure Modeling of Wire Bonds of High Power LED Packages with a Multiphysics Simulation Method
    Chen, Kai
    Fan, Jiajie
    Qian, Cheng
    BinTang
    Fan, Xuejun
    Zhang, Guoqi
    2016 13TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING (SSLCHINA 2016), 2016, : 39 - 43
  • [44] Thermal Diffusion Analysis for LED Module
    Su, Ay
    Liu, Y.
    Chen, C.
    HEAT TRANSFER-ASIAN RESEARCH, 2007, 36 (08): : 449 - 458
  • [45] Thermal investigation of LED lighting module
    Choi, Jong Hwa
    Shin, Moo Whan
    MICROELECTRONICS RELIABILITY, 2012, 52 (05) : 830 - 835
  • [46] Thermal distribution of multiple LED module
    Zhou, Jicheng
    Huang, Jinhui
    Wang, Yunyun
    Zhou, Zhuang
    APPLIED THERMAL ENGINEERING, 2016, 93 : 122 - 130
  • [47] Thermal Fluid Simulation Modeling and Fatigue Analysis of Double-Sided Cooling Power Module Based on Thermal Transient Test
    Hara, Tomoaki
    Aoki, Yoshitaka
    Funaki, Tsuyoshi
    2021 27TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2021,
  • [48] A Study of an LED Backlight Thermal Module
    Su, Ay
    Chen, S.
    Lin, Y.
    HEAT TRANSFER-ASIAN RESEARCH, 2010, 39 (08): : 619 - 627
  • [49] Thermal-hydraulic Modeling and Simulation of High Power Hydro-motor
    Li, Yonglin
    Su, Xinbing
    Xu, Haojun
    Li, Dawei
    7TH INTERNATIONAL CONFERENCE ON SYSTEM SIMULATION AND SCIENTIFIC COMPUTING ASIA SIMULATION CONFERENCE 2008, VOLS 1-3, 2008, : 841 - 844
  • [50] Characterization, modeling and optimization of high power module packaging
    Trivedi, M
    Shenai, K
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1997, : 103 - 106
12345