Design and reliability study for flip chip applications on ultra-thin flexible substrates using nanopierce connection system technology

被引：0
|
作者：
Zou, B [1 ]
Kober, M [1 ]
Blum, F [1 ]
Mieslinger, S [1 ]
Gaherty, L [1 ]
Steinberg, W [1 ]
Bahn, B [1 ]
Wernle, M [1 ]
Neuhaus, H [1 ]
机构：
[1] Nanopierce Technol Inc, Colorado Springs, CO 80916 USA
来源：
2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 2002年 / 4931卷
关键词：
NCS; ultra-thin flex substrates; flip chip; DOE; reliability;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The special performance requirements of chip attach in the growing market of mobile electronics such as mobile phones, laptops, PDA's and smartlabels necessitate a re-examination of cost and reliability of assembly technologies used to mount flip chip dice on flex substrates. This paper reports a design-of-experiment (DOE) matrix that was constructed to identify significant factors to electric performance and comprehensive reliability tests of NanoPierce Connection System (NCS) for the assembly of dice in a unique flip chip technology. These tests were adapted to emphasize the reliability of flip chip application using NCS on ultra-thin flex substrates. An optimized manufacturing process window was determined from the results obtained in the DOE study. In addition, the results from the reliability tests showed that the NCS technology has great stability and reliability during all the tests, and performs better than conventional flip chip technologies and well beyond the manufacturer specifications.
引用
收藏
页码：818 / 824
页数：7
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