Effect of thermal and electromigration exposure on solder joint board level drop reliability

被引：0
|
作者：
Xu, Luhua [1 ]
Pang, John H. L. [1 ]
机构：
[1] Nanyang Technol Univ, Sch Aerosp & Mech Engn, 50 Nanyang Ave, Singapore 639798, Singapore
来源：
EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2006年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The combined sequential reliability test of thermal cycling aging or electromigration test followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. hiterfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging and combined thermal-electromigration. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface.
引用
收藏
页码：570 / 575
页数：6
相关论文
共 50 条
  • [1] Combined thermal and electromigration exposure effect on SnAgCuBGA solder joint reliability
    Xu, Luhua
    Pang, John H. L.
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1154 - +
  • [2] Dynamic responses and solder joint reliability under board level drop test
    Luan, Jing-en
    Tee, Tong Yan
    Pek, Eric
    Lim, Chwee Teck
    Zhong, Zhaowei
    MICROELECTRONICS RELIABILITY, 2007, 47 (2-3) : 450 - 460
  • [3] Modeling Solder Joint Reliability of VFBGA Packages under Board Level Drop Test Based on Dynamic Constitutive Relation with Thermal Effect
    Niu, Xiaoyan
    Chen, Tong
    Li, Zhigang
    Shu, Xuefeng
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 289 - 293
  • [4] Investigating effect of unfilled underfills on board level solder joint reliability of area array packages under drop test and thermal cycling test
    Ibe, ES
    Loh, KI
    Luan, JE
    Tee, TY
    PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 579 - 583
  • [5] Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test
    Tee, TY
    Ng, HS
    Zhong, ZW
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 210 - 216
  • [6] Effect of solder composition and substrate surface finish on board level drop test reliability
    Jiang, Don-Son
    Hung, Joe
    Wang, Yu-Po
    Hsiao, C. S.
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 1109 - 1113
  • [7] Thermal performance and solder joint reliability for board level assembly of modified leadframe package
    Lee, CC
    Lee, CC
    Chiang, KN
    THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2005, : 553 - 558
  • [8] Solder joint reliability under electromigration and thermal-mechanical load
    Wang, ShiNan
    Liang, Lihua
    Liu, Yong
    Irving, Scott
    Luk, Timwah
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1074 - +
  • [9] Effects of solder joint shapes on reliability of BGA packages under board level drop impact loads
    Yang, Xue-Xia
    Xiao, Ge-Sheng
    Shu, Xue-Feng
    Zhendong yu Chongji/Journal of Vibration and Shock, 2013, 32 (01): : 104 - 107
  • [10] Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint
    Xu, Luhua
    Pang, John H. L.
    56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 275 - +
12345