Effect of thermal and electromigration exposure on solder joint board level drop reliability

被引：0

作者：

Xu, Luhua ^{[1
]}

Pang, John H. L. ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Aerosp & Mech Engn, 50 Nanyang Ave, Singapore 639798, Singapore

来源：

EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2006年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The combined sequential reliability test of thermal cycling aging or electromigration test followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. hiterfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging and combined thermal-electromigration. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface.

引用

页码：570 / 575

页数：6

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