Demonstration of Board-Level Optical Link with Ceramic Optoelectronic Multi-Chip Module

被引：5

作者：

Nieweglowski, Krzysztof ^{[1
]}

Rieske, Ralf ^{[1
]}

Wolter, Klaus-Juergen ^{[1
]}

机构：

[1] Tech Univ Dresden, Elect Packaging Lab, D-01062 Dresden, Germany

来源：

2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4 | 2009年

关键词：

D O I：

10.1109/ECTC.2009.5074276

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper demonstrates a complete short-distance parallel optical interconnection on PCB-level basing on ceramic transmitter/receiver modules for high-speed signal conversion, integrated polymeric waveguides and the optical coupling elements. The novel technology for the structuring of PCB-compatible high density parallel optical interconnects will be described in detail. The solution for the optical coupling into the integrated waveguides is based on a micro-optical indirect coupling element with wave guiding structures. The demonstrated optoelectronic modules are 4-channel BGA ceramic multi-chip modules with 4 x 10 Gbps transmission capacity.

引用

页码：1879 / 1886

页数：8

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