Organic Multi-Chip Module for High Performance Systems

被引：0

作者：

Shan, Lei ^{[1
]}

Kwark, Young ^{[1
]}

Baks, Christian ^{[1
]}

Gaynes, Michael ^{[1
]}

Chainer, Timothy ^{[1
]}

Kapfhammer, Mark ^{[2
]}

Saiki, Hajime ^{[3
]}

Kuhara, Atsushi ^{[3
]}

Aguiar, Gil ^{[3
]}

Ban, Noritaka ^{[3
]}

Nukaya, Yoshiki ^{[3
]}

机构：

[1] IBM TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA

[2] IBM Semicond Res Dev Ctr, Hopewell Jct, NY 12533 USA

[3] NTK Technol, Nagoya, Aichi, Japan

来源：

2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2015年

关键词：

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

In this work, IBM Research and NTK Technologies have explored the development of an organic Multi-Chip Module (MCM) solution, with the goal of developing innovative technologies that address the requirements of high performance systems. A 90 x 90 mm organic MCM was designed, fabricated, and assembled with dual side mountable 24 x 28 mm thermal test chips mounted on chip-scale interposers to enable functional screening and rework process. The work demonstrated that a large scale organic MCM was compatible with LGA sockets with over 6000 contacts.

引用

页码：1725 / 1729

页数：5

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