A resonant miniature electric field sensor using bulk-micromachining process

被引：0

作者：

Deng, K ^{[1
]}

Xia, SH ^{[1
]}

Gong, C ^{[1
]}

Peng, CR ^{[1
]}

Tao, H ^{[1
]}

Bai, Q ^{[1
]}

Chen, SF ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Elect, State Key Lab Transducer Technol, Beijing 100080, Peoples R China

来源：

PROGRESS IN NATURAL SCIENCE-MATERIALS INTERNATIONAL | 2005年 / 15卷 / 06期

关键词：

micro electro mechanical systems (MEMS); bulk-micromachining; anodic bonding; deep reactive ion etching (DRIE);

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A novel design of a resonant miniature electric field sensor based on microfabrication technology is proposed. The operating principles and specifications, the design structure, and the silicon-based bulk-micromachining fabrication process are presented. The finite element simulation shows that our design can obtain good results in device parameters setting, and its simplicity and low-cost features make it an attractive product for future applications.

引用

页码：569 / 572

页数：4

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