Towards Ultrasound Everywhere: A Portable 3D Digital Back-End Capable of Zone and Compound Imaging

被引:9
|
作者
Ibrahim, Aya [1 ]
Zhang, Shuping [2 ]
Angiolini, Federico [1 ]
Arditi, Marcel [1 ]
Kimura, Shinji [2 ]
Goto, Satoshi [2 ]
Thiran, Jean-Philippe [1 ,3 ,4 ]
De Micheli, Giovanni [1 ]
机构
[1] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland
[2] Waseda Univ, Tokyo 1698050, Japan
[3] Univ Hosp Ctr CHUV, Dept Radiol, Lausanne, Switzerland
[4] Univ Lausanne UNIL, Lausanne, Switzerland
关键词
Field programmable gate arrays; telesonography; ultrasound imaging; ultrasound quality metrics; volumetric ultrasound reconstruction-3D imaging; ARRAY TRANSDUCER; 2-D; DESIGN;
D O I
10.1109/TBCAS.2018.2828382
中图分类号
R318 [生物医学工程];
学科分类号
0831 ;
摘要
Ultrasound imaging is a ubiquitous diagnostic technique, but does not fit the requirements of the telemedicine approach, because it relies on the real-time manipulation and image recognition skills of a trained expert, called sonographer. Sonographers are only available in hospitals and clinics, negating or at least delaying access to ultrasound scans in many locales-rural areas, developing countries-as well as in medical rescue operations. Telesonography would require an advanced imager that supports three-dimensional (3-D) acquisition; this would allow untrained operators to acquire broad scans and upload them remotely for diagnosis. Such advanced imagers do exist, but do not meet several other requirements for telesonography, such as being portable, inexpensive, and sufficiently low power to enable battery operation. In thiswork, we present our prototype of the first portable 3-D digital ultrasound back-end system. The prototype is implemented in a single midrange Xilinx field programmable gate array (FPGA), for an estimated power consumption of 5 W. The device supports up to 1024 input channels, which is state of the art and could be scaled further, and supports multiple image reconstruction modes. We evaluate the resource utilization of the FPGA and provide various quality metrics to ascertain the output image quality.
引用
收藏
页码:968 / 981
页数:14
相关论文
共 31 条
  • [1] Development of a portable 3D ultrasound imaging system for musculoskeletal tissues
    Huang, QH
    Zheng, YP
    Lu, MH
    Chi, ZR
    [J]. ULTRASONICS, 2005, 43 (03) : 153 - 163
  • [2] High density, low leakage Back-End 3D capacitors for mixed signals applications
    Detalle, M.
    Barrenetxea, M.
    Muller, P.
    Potoms, G.
    Phommahaxay, A.
    Soussan, P.
    Vaesen, K.
    De Raedt, W.
    [J]. MICROELECTRONIC ENGINEERING, 2010, 87 (12) : 2571 - 2576
  • [3] High performances 3D damascene MIM capacitors integrated in copper back-end technologies
    Cremer, S.
    Richard, C.
    Benoit, D.
    Besset, C.
    Manceau, J-P
    Farcy, A.
    Perrot, C.
    Segura, N.
    Marin, M.
    Becu, S.
    Boret, S.
    Thomas, M.
    Guillaumet, S.
    Bonnard, A.
    Delpech, P.
    Bruyere, S.
    [J]. PROCEEDINGS OF THE 2006 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING, 2006, : 259 - +
  • [4] Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC digital design
    Vianello, E.
    Thomas, O.
    Harrand, M.
    Onkaraiah, S.
    Cabout, T.
    Traore, B.
    Diokh, T.
    Oucheikh, H.
    Perniola, L.
    Molas, G.
    Blaise, P.
    Nodin, J. F.
    Jalaguier, E.
    De Salvo, B.
    [J]. 2013 INTERNATIONAL CONFERENCE ON IC DESIGN AND TECHNOLOGY (ICICDT), 2013, : 235 - 238
  • [5] Monolithic 3D integration of back-end compatible 2D material FET on Si FinFET
    Shi-Xian Guan
    Tilo H. Yang
    Chih-Hao Yang
    Chuan-Jie Hong
    Bor-Wei Liang
    Kristan Bryan Simbulan
    Jyun-Hong Chen
    Chun-Jung Su
    Kai-Shin Li
    Yuan-Liang Zhong
    Lain-Jong Li
    Yann-Wen Lan
    [J]. npj 2D Materials and Applications, 7
  • [6] Monolithic 3D integration of back-end compatible 2D material FET on Si FinFET
    Guan, Shi-Xian
    Yang, Tilo H. H.
    Yang, Chih-Hao
    Hong, Chuan-Jie
    Liang, Bor-Wei
    Simbulan, Kristan Bryan
    Chen, Jyun-Hong
    Su, Chun-Jung
    Li, Kai-Shin
    Zhong, Yuan-Liang
    Li, Lain-Jong
    Lan, Yann-Wen
    [J]. NPJ 2D MATERIALS AND APPLICATIONS, 2023, 7 (01)
  • [7] Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform
    Pozder, S
    Lu, JQ
    Kwon, Y
    Zollner, S
    Yu, J
    McMahon, JJ
    Cale, TS
    Yu, K
    Gutmann, RJ
    [J]. PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, : 102 - 104
  • [8] A Portable 2 x 2 Digital 3D CZT Imaging Spectrometer System
    Streicher, Michael
    Zhu, Yuefeng
    Zhang, Feng
    Boucher, Yvan A.
    Wahl, Christopher G.
    Yang, Hao
    He, Zhong
    [J]. 2014 IEEE NUCLEAR SCIENCE SYMPOSIUM AND MEDICAL IMAGING CONFERENCE (NSS/MIC), 2014,
  • [9] Fully Back-end TSV Process by Cu Electro-less Plating for 3D Smart Sensor Systems
    Santagata, F.
    Fiorentino, G.
    Nie, M.
    Farriciello, C.
    Poelma, R.
    Zhang, G. Q.
    Sarro, P. M.
    Nie, M.
    [J]. 2012 IEEE SENSORS PROCEEDINGS, 2012, : 668 - 671
  • [10] Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems
    Santagata, F.
    Farriciello, C.
    Fiorentino, G.
    van Zeijl, H. W.
    Silvestri, C.
    Zhang, G. Q.
    Sarro, P. M.
    [J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2013, 23 (05)