A high performance 1.5V, 0.10μm gate length CMOS technology with scaled copper metallization

被引:13
|
作者
Gilbert, P [1 ]
Yang, I [1 ]
Pettinato, C [1 ]
Angyal, M [1 ]
Boeck, B [1 ]
Fu, C [1 ]
VanGompel, T [1 ]
Tiwari, R [1 ]
Sparks, T [1 ]
Clark, W [1 ]
Dang, C [1 ]
Mendonca, J [1 ]
Chu, B [1 ]
Lucas, K [1 ]
Kling, M [1 ]
Roman, B [1 ]
Park, E [1 ]
Huang, F [1 ]
Woods, M [1 ]
Rose, D [1 ]
McGuffin, K [1 ]
Nghiem, A [1 ]
Banks, E [1 ]
McNelly, T [1 ]
Feng, C [1 ]
Sturtevant, J [1 ]
De, H [1 ]
Das, A [1 ]
Veeraraghavan, S [1 ]
Nkansah, F [1 ]
Bhat, M [1 ]
机构
[1] Motorola Inc, Networking & Comp Syst Grp, Austin, TX 78721 USA
关键词
D O I
10.1109/IEDM.1998.746526
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high performance 0.10 mu m gate length CMOS technology has been developed with six levels of scaled copper interconnects. Transistors of 0.10 mu m-0.13 mu m gate length with physical 3 nm gate oxides and 0.175 mu m local interconnect features are optimized for 1.5V operation to achieve a 15 ps unloaded ring oscillator delay. Complementary Phase Shift Masks (c:PSM) for superior gate control and Low-K dielectrics for reduced coupling capacitance enable an aggressive (>15%) linear shrink of the previous generation copper-based technology [1]. Critical technology layer pitches summarized in Table 1 enable fabrication of 4.5 mu m(2) 6T-SRAM cells.
引用
收藏
页码:1013 / 1016
页数:4
相关论文
共 50 条
  • [41] High performance FDSOI CMOS technology with metal gate and high-k
    Doris, B
    Kim, YH
    Linder, BP
    Steen, M
    Narayanan, V
    Boyd, D
    Rubino, J
    Chang, L
    Sleight, J
    Topol, A
    Sikorski, E
    Shi, L
    Wong, K
    Babich, K
    Zhang, Y
    Kirsch, P
    Newbury, J
    Walker, GF
    Carruthers, R
    D'Emic, C
    Kozlowski, P
    Jammy, R
    Guarini, KW
    Leong, M
    2005 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2005, : 214 - 215
  • [42] Influence of gate length on ESD-performance for deep sub micron CMOS technology
    Bock, K
    Keppens, B
    De Heyn, V
    Groeseneken, G
    Ching, LY
    Naem, A
    ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM PROCEEDINGS, 1999, 1999, : 95 - 104
  • [43] HIGH-PERFORMANCE SUBQUARTER-MICROMETER GATE CMOS TECHNOLOGY
    OKAZAKI, Y
    KOBAYASHI, T
    MIYAKE, M
    MATSUDA, T
    SAKUMA, K
    KAWAI, Y
    TAKAHASHI, M
    KANISAWA, K
    IEEE ELECTRON DEVICE LETTERS, 1990, 11 (04) : 134 - 136
  • [44] Ultra-thin gate oxide technology for high performance CMOS
    Momose, HS
    Nakamura, S
    Katsumata, Y
    Iwai, H
    ULSI SCIENCE AND TECHNOLOGY / 1997: PROCEEDINGS OF THE SIXTH INTERNATIONAL SYMPOSIUM ON ULTRALARGE SCALE INTEGRATION SCIENCE AND TECHNOLOGY, 1997, 1997 (03): : 235 - 246
  • [45] A, 19.5mW 1.5V 10-bit pipeline ADC for DVB-H systems in 0.35 μm CMOS
    Adeniran, Olujide A.
    Demosthenous, Andreas
    2006 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-11, PROCEEDINGS, 2006, : 5351 - +
  • [46] A high performance 0.12 μm CMOS with manufacturable 0.18 μm technology
    Ichinose, K
    Saito, T
    Yanagida, Y
    Nonaka, Y
    Torii, K
    Sato, H
    Saito, N
    Wada, S
    Mori, K
    Mitani, S
    2001 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2001, : 103 - 104
  • [47] 0.18 mu m gate length CMOS devices with N+ polycide gate for 2.5V application
    Choi, JY
    Zhang, E
    Han, CC
    MICROELECTRONIC DEVICE TECHNOLOGY, 1997, 3212 : 220 - 225
  • [48] A manufacturable 0.30 mu M gate CMOS technology for high speed microprocessors
    Appel, A
    Crank, S
    Kim, Y
    Scharrer, C
    Strong, B
    Yao, M
    Tigelaar, H
    Melanson, R
    1996 SYMPOSIUM ON VLSI TECHNOLOGY: DIGEST OF TECHNICAL PAPERS, 1996, : 220 - 221
  • [49] A 0.8-MU-M CMOS TECHNOLOGY FOR HIGH-PERFORMANCE ASIC MEMORY AND CHANNELLESS GATE ARRAY
    LIOU, FT
    HAN, YP
    BRYANT, FR
    ZAMANIAN, M
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1989, 24 (02) : 380 - 387
  • [50] A very high performance and manufacturable 3.3 V 0.35-mu m CMOS technology for ASICs
    Kizilyalli, C
    Lytle, S
    Jones, BR
    Martin, EP
    Shive, SF
    Brooks, AL
    Thoma, MJ
    Schanzer, RW
    Sniegowski, JW
    Wroge, DM
    Key, RW
    Kearney, JW
    Stiles, KR
    PROCEEDINGS OF THE IEEE 1996 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 1996, : 31 - 34