A high performance 1.5V, 0.10μm gate length CMOS technology with scaled copper metallization

被引:13
|
作者
Gilbert, P [1 ]
Yang, I [1 ]
Pettinato, C [1 ]
Angyal, M [1 ]
Boeck, B [1 ]
Fu, C [1 ]
VanGompel, T [1 ]
Tiwari, R [1 ]
Sparks, T [1 ]
Clark, W [1 ]
Dang, C [1 ]
Mendonca, J [1 ]
Chu, B [1 ]
Lucas, K [1 ]
Kling, M [1 ]
Roman, B [1 ]
Park, E [1 ]
Huang, F [1 ]
Woods, M [1 ]
Rose, D [1 ]
McGuffin, K [1 ]
Nghiem, A [1 ]
Banks, E [1 ]
McNelly, T [1 ]
Feng, C [1 ]
Sturtevant, J [1 ]
De, H [1 ]
Das, A [1 ]
Veeraraghavan, S [1 ]
Nkansah, F [1 ]
Bhat, M [1 ]
机构
[1] Motorola Inc, Networking & Comp Syst Grp, Austin, TX 78721 USA
关键词
D O I
10.1109/IEDM.1998.746526
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A high performance 0.10 mu m gate length CMOS technology has been developed with six levels of scaled copper interconnects. Transistors of 0.10 mu m-0.13 mu m gate length with physical 3 nm gate oxides and 0.175 mu m local interconnect features are optimized for 1.5V operation to achieve a 15 ps unloaded ring oscillator delay. Complementary Phase Shift Masks (c:PSM) for superior gate control and Low-K dielectrics for reduced coupling capacitance enable an aggressive (>15%) linear shrink of the previous generation copper-based technology [1]. Critical technology layer pitches summarized in Table 1 enable fabrication of 4.5 mu m(2) 6T-SRAM cells.
引用
收藏
页码:1013 / 1016
页数:4
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