Scan Chain and Power Delivery Network Synthesis for Pre-Bond Test of 3D ICs

被引：0
|
作者：
Panth, Shreepad [1 ]
Lim, Sung Kyu [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
2011 IEEE 29TH VLSI TEST SYMPOSIUM (VTS) | 2011年
关键词：
3D ICs; pre-bond test; structural test; probe test; power delivery network;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Pre-bond testing of 3D ICs improves yield by preventing bad dies and/or wafers from being used in the final 3D stack. However, pre-bond testing is challenging because it requires special scan chains and power delivery mechanism. Any 3D scan chains that traverse multiple dies will be fragmentized in each individual die during pre-bond testing. In this paper we study the scan chain and power delivery network synthesis for pre-bond testing of 3D ICs. The testing of individual dies is facilitated by the addition of dedicated probe pads for power delivery and scan IO as a form of design-for-testing. We investigate the impact of scan-chain Through-Silicon-Vias (TSVs) on power consumption and voltage drop. We also study the requirements of power probe pads for power delivery during pre-bond structural test.
引用
收藏
页码：26 / 31
页数：6
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