A 3T Gain Cell Embedded DRAM Utilizing Preferential Boosting for High Density and Low Power On-Die Caches

被引:68
|
作者
Chun, Ki Chul [1 ]
Jain, Pulkit [1 ]
Lee, Jung Hwa [2 ]
Kim, Chris H. [1 ]
机构
[1] Univ Minnesota, Dept Elect & Comp Engn, Minneapolis, MN 55455 USA
[2] Samsung Elect, Memory Div, DRAM Design Team, Hwasung 445701, Kyeonggi Do, South Korea
关键词
Cache; logic-compatible eDRAM; low-power; low-voltage; 3T gain cell; CURRENT SENSE AMPLIFIER;
D O I
10.1109/JSSC.2011.2128150
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Circuit techniques for enabling a sub-0.9 V logic-compatible embedded DRAM (eDRAM) are presented. A boosted 3T gain cell utilizes Read Word-line (RWL) preferential boosting to increase read margin and improve data retention time. Read speed is enhanced with a hybrid current/voltage sense amplifier that allows the Read Bit-line (RBL) to remain close to VDD. A regulated bit-line write scheme for driving the Write Bit-line (WBL) is equipped with a steady-state storage node voltage monitor to overcome the data '1' write disturbance problem of the PMOS gain cell without introducing another boosted supply for the Write Word-line (WWL) over-drive. An adaptive and die-to-die adjustable read reference bias generator is proposed to cope with PVT variations. Monte Carlo simulations compare the 6-sigma read and write performance of proposed eDRAM against conventional designs. Measurement results from a 64 kb eDRAM test chip implemented in a 65 nm low-leakage CMOS process show a 1.25 ms data retention time with a 2 ns random cycle time at 0.9 V, 85 degrees C, and a 91.3 mu W per Mb static power dissipation at 1.0 V, 85 degrees C.
引用
收藏
页码:1495 / 1505
页数:11
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