Advances in laser direct writing

Recent improvements in the laser direct write technology are reviewed with particular emphasis on new applications for micromechanics and advanced electronic packaging. The laser stereo etching method has been scaled so as to permit the accurate three-dimensional etching of silicon in a chlorine ambient at a rate of one-half million cubic micrometers per second. Laser deposition processes have been found for the direct writing of metal interconnects on copper/polyimide substrates and similar materials for multichip modules. Apparatus to implement these processes on highly three-dimensional substrates has been developed.