Influence of current density on microstructure of pulse electrodeposited tin coatings

被引：45

作者：

Sharma, Ashutosh ^{[1
]}

Bhattacharya, Sumit ^{[1
]}

Sen, Ranjan ^{[1
]}

Reddy, B. S. B. ^{[1
]}

Fecht, H-J ^{[2
]}

Das, Karabi ^{[1
]}

Das, Siddhartha

机构：

[1] Indian Inst Technol Kharagpur, Dept Met & Mat Engn, Kharagpur 721302, W Bengal, India

[2] Univ Ulm, Inst Mikro & Nanomat, D-89081 Ulm, Germany

来源：

MATERIALS CHARACTERIZATION | 2012年 / 68卷

关键词：

Coatings; Pulse electrodeposition; Current density; Diffusion; SURFACE-ENERGY ANISOTROPY; WHISKER GROWTH; TEXTURAL EVOLUTION; SN-CU; MORPHOLOGY; HYDROGEN; ELECTROLYTE; NUCLEATION; ADDITIVES; POROSITY;

D O I：

10.1016/j.matchar.2012.03.002

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Pulse electrodeposited tin coatings on copper substrate have been synthesized from an aqueous solution containing sodium stannate (Na(2)SnO(3 center dot)3H(2)O) and sodium hydroxide (NaOH). The effect of current density on surface morphology of the deposits has been investigated. As deposited coatings are characterized by X-ray diffraction, scanning electron microscopy, electron backscatter diffraction, and line profile analysis. The X-ray diffraction analysis shows that the deposits consist of tetragonal (beta-Sn) structure with microcrystalline grains. The deposits plated at lower current density exhibit (110) texture which decreases with increasing current densities. The effects of current density on Cu-Sn diffusion and whisker growth of the electrodeposited tin coatings are also reported here. (C) 2012 Elsevier Inc. All rights reserved.

引用

页码：22 / 32

页数：11

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