3-D electromagnetic analysis of the package influence on the IC performance

被引：0

作者：

Nosal, Z ^{[1
]}

Abramowicz, A ^{[1
]}

机构：

[1] Warsaw Univ Technol, Inst Elect Syst, PL-00665 Warsaw, Poland

来源：

MIKON-2000, VOLS 1 & 2, PROCEEDINGS | 2000年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An integrated circuit package has been analyzed using the 3 dimensional FDTD simulator. The finite isolation between IC leads and the lead impedances can be precisely computed The computed characteristics have been used to develop a circuit model of the package. Then the influence of the package on the integrated circuit performance has been investigated with the high frequency circuit simulators. Presented results show a necessity of including package properties in the RF and microwave IC design process.

引用

页码：561 / 564

页数：4

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