Yield analysis for self-repairable MEMS devices

被引：2

作者：

Xiong, Xingguo ^{[1
]}

Wu, Yu-Liang ^{[2
]}

Jone, Wen-Ben ^{[3
]}

机构：

[1] Univ Bridgeport, Dept Elect & Comp Engn, Bridgeport, CT 06604 USA

[2] Chinese Univ Hong Kong, Dept Comp Sci & Engn, Shattin, Hong Kong, Peoples R China

[3] Univ Cincinnati, Dept ECECS, Cincinnati, OH 45221 USA

来源：

ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING | 2008年 / 56卷 / 1-2期

关键词：

yield analysis; built-in self-repair (BISR); MEMS; micro-accelerometer; redundancy repair;

D O I：

10.1007/s10470-007-9111-3

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper, yield analysis for a self-repairable MEMS (SRMEMS) accelerometer design is proposed. The accelerometer consists of (n + m) identical modules: n of them serve as the main device, while the remaining m modules act as the redundancy. The yield model for MEMS redundancy repair is developed by statistical analysis. Based upon the yield model, the yield increase after redundancy repair for different in and n numbers is analyzed. ANSYS Monte Carlo simulation is used to estimate the yield of BISR/non-BISR MEMS devices with random point-stiction defects. The simulation results are in good agreement with the theoretical prediction based on our yield model. The simulation results also show that the SRMEMS leads to effective yield increase compared to non-BISRS design, especially for a moderate initial yield.

引用

页码：71 / 81

页数：11

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